Benefits of 3DXSTAT™ include:
Ideal for printing without a heated bed
- no enclosure required
" Low shrink / warp - very easy to print
" Low odor
- ideal for printing in public spaces / office environments
" Consistent and reliable surface resistance
" Improved retention of impact & elongation vs. similiar ESD-safe materials
" Low particulate contamination
" Minimal contribution to outgassing and ionic contamination
Typical applications include:
" Semi-con: HDD Components, Housings, Wafer Handling, Jigs, Casings, & Connectors
" Industrial: Fixtures, Conveying, Metering, End-of-arm Tooling, and Sensing applications
Target conductivity for 3DXSTAT™ ESD PLA:
" Spec: 10^6 to 10^9 Ohm surface resistivity on 3DP sample using concentric ring method, target 10^7 Ohm
" Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry. Therefore, expect some trial time to understand how this filament works in your specific printer / application.
Recommended Print Conditions:
" Extruder Temp: Typically 210-220°C. 3DXSTAT™ ESD PLA is a filled product and has a higher melt viscosity vs. unfilled PLA. Therefore, it is sometimes necessary to print at higher temperatures than your standard PLA to allow the resin to flow properly.
" Extrusion Multiplier: 1.15 - 1.20
" Extrusion Speed: 60mm/s or higher
" Bed Temp: 23-60°C
" Fan Speed: 50-100% starting on 2nd layer
" Bed Prep: Blue Tape, Hairspray on clean glass
| Speed | 6mm/min |
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| Recommended printing temperature | 215±10°C |
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| Packaging dimensions (with box) | 235 x 215 x 80 mm |
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| Decomposition temperature | 230°C |
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| Tolerance | 1.75±0.03 / 3.00±0.05 |
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| Hot bed temperature | 60°C |
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| Packaging weight (with box) | 1.45 kg approx. |
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| Melting point | 170°C |
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| First layer temperature | 215°C |
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| 0.25 mm |
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| Distortion temperature | 55°C |
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